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About Us
Power-Semiconductors
GaN-on-Si HEMT
650V
150V
100V
60V
40V
30V
Silicon FET
Opto-Semiconductors
Infrared LED Chips
Photodiode Chips
Phototransistor Chips
CREE LED Chips
EZ Series - P side up
SR Series
SA Series
SD Series
White Color Chips
EZ-N Series (Limited Edition)
TR Series (Limited Edition)
RT Series (Limited Edition)
UT Series (Limited Edition)
MB Series (Limited Edition)
CB Series (Limited Edition)
FOCUS LIGHTINGS
OS Component/Module
General Application
Ceramic Type
EMC Type
PLCC Type
SMD Type
Ultraviolet
ODM Service
LED with AEC-Q
AIoT
Ouster LiDAR
Outsight Software
Contact Us
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EZ400-p
Regular price
$0.00
Default Title -
$0.00 TWD
FEATURES:
Lambertian Radiation Pattern
Anode-up design (p-pad up)
EZBright LED Technology, binned @175 mA
450 nm – 180+ mW
460 nm – 180+ mW
470 nm – 160+ mW
527 nm – 40+ mW
Forward Voltage (Vf) – 3.4 V Typical at 175 mA
Maximum DC Forward Current – 200 mA
Backside Metal versions for various attach methods:
AuSn for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms
Au for Conductive Adhesives (i.e. Ag paste)
2kV Class 2 ESD Rating
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