SR2025

FEATURES

• RF Performance @20 mA:
  • 470 nm – 4.0+ mW
• Forward Voltage
  • 3.35 V typical @20 mA
    
• For use with Clear Adhesive Die Attach
• 80 µm Bonding Area (both Bond Pads)
• 100 µm Chip Thickness
• 2 kV, class 2 ESD Rating