SR370

FEATURES 

• RF Performance @20 mA:
  • 450 nm – 32+ mW
  • 460 nm – 30+ mW
    
  • 470 nm – 28+ mW
  • 527 nm – 17+ mW
• Low Forward Voltage
  • 2.7 V typical @20 mA
• Distributed Bragg Reflector (DBR)
• For use with Clear Adhesive Die Attach
• 82 µm Bonding Area (both Bond Pads)
• 110 µm Chip Thickness
• 2 kV, class 2 ESD Rating