SR550

FEATURES

RF Performance @80 mA:
- 450 nm – 130+ mW
- 460 nm – 120+ mW
- 470 nm – 100+ mW
- 527 nm – 55+ mW
Low Forward Voltage
- 2.95 V typical @80 mA
Distributed Bragg Reflector (DBR)
For use with Clear Adhesive Die Attach
67 µm Bonding Area (both Bond Pads)
200 µm Chip Thickness
2 kV, class 2 ESD Rating