SR260

FEATURES 

• RF Performance @20 mA:
  • 470 nm – 8.0+ mW
  • 527 nm – 3.3+ mW
    
• Forward Voltage
  • 3.2 V typical @20 mA
• For use with Clear Adhesive Die Attach
• 80 µm Bonding Area (both Bond Pads)
• 100 µm Chip Thickness
• 2 kV, class 2 ESD Rating