SR550

FEATURES 

• RF Performance @80 mA:
  • 450 nm – 130+ mW
  • 460 nm – 120+ mW
    
  • 470 nm – 100+ mW
  • 527 nm – 55+ mW
• Low Forward Voltage
  • 2.95 V typical @80 mA
• Distributed Bragg Reflector (DBR)
• For use with Clear Adhesive Die Attach
• 67 µm Bonding Area (both Bond Pads)
• 200 µm Chip Thickness
• 2 kV, class 2 ESD Rating