SR1321

FEATURES 

• RF Performance @5 mA:
  • 450 nm – 6.0+ mW
  • 460 nm – 5.5+ mW
    
  • 470 nm – 5.0+ mW
  • 527 nm – 3.3+ mW
• Low Forward Voltage
• 2.8 V typical @5 mA
• For use with Clear Adhesive Die Attach
• 60 µm Bonding Area (both Bond Pads)
• 110 µm Chip Thickness
• 2 kV, class 2 ESD Rating